Odisha Takes First Steps Towards India’s Chip Unit
In the next step to bolster India’s place in today’s semiconductor race, Odisha CM Mohan Majhi and IT Minister Ashwini Vaishnaw laid the foundation stone of a 3D chip packaging unit in Bhubaneshwar. The unit is being set up by Heterogeneous Integration Packaging Solution Pvt Ltd, a fully owned subsidiary of the US’s 3D Glass…
Shipra Prajapati