In the next step to bolster India’s place in today’s semiconductor race, Odisha CM Mohan Majhi and IT Minister Ashwini Vaishnaw laid the foundation stone of a 3D chip packaging unit in Bhubaneshwar.
The unit is being set up by Heterogeneous Integration Packaging Solution Pvt Ltd, a fully owned subsidiary of the US’s 3D Glass Solutions Inc. Though there are more partners in the mix, including Lockheed Martin, Intel, and Applied Materials. In total, the unit is projected to generate around 2500 direct or indirect jobs.
The ₹1943.5 crore project under the India Semiconductor Mission will be fully completed by Aug 2028 and is poised to begin full-scale production by mid-2030. As per the plans, the plant will have a packaging capacity of around 70,000 glass panels, 50 million assembled units, and 13,200 advanced 3DHI modules, the CM said.
Union IT Minister Ashwini Vaishnaw shared his views on the development and said that it’s extremely important for the state to have a high-tech packaging plant, as Odisha is projecting itself as a major attractor of the FDA, especially in semiconductor plants. CM Majhi also reiterated this and said that Odisha has become the number one state for investors, having already attracted more than ₹10,000 crore to its semiconductor sector.
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He further added that Odisha will play a key role in bringing the vision of the prime minister to reality. The CEO of Intel, Lip-Bu Tan, also joined the event virtually.
