The Dimensity 8450 system-on-chip (SoC) is built to enable seamless streaming, broadcasting, recording, editing, and publishing — boasting performance speeds up to 30% faster than competing platforms
MediaTek has launched its latest premium smartphone chipset, the Dimensity 8450, at the MediaTek India Dimensity Summit 2025. The new 5G chip is designed to deliver top-tier performance, advanced AI capabilities, high-efficiency power management, and an enhanced gaming experience.
The launch event also marked the first anniversary of MediaTek Connect, a growing community of tech enthusiasts and fans. A special gaming tournament using MediaTek Dimensity-powered devices was held to celebrate the occasion, alongside demonstrations of the company’s complete Dimensity 5G chipset lineup.
“With the launch of the Dimensity 8450, we’re expanding our lineup of high-performance platforms, allowing device makers to offer more premium experiences,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business Unit. “From generative AI to mobile gaming, this chip delivers the power users need.”
The Dimensity 8450 system-on-chip (SoC) is built to enable seamless streaming, broadcasting, recording, editing, and publishing — boasting performance speeds up to 30% faster than competing platforms. The chip features an All Big Core CPU design with eight Arm Cortex-A725 cores and an Arm Mali-G720 MC7 GPU, combining peak power with energy efficiency.
Other key highlights include MediaTek’s Dimensity Agentic AI Engine, which supports major global LLMs, SLMs, and LMMs, as well as the powerful NPU 880 for advanced generative AI and camera features. The chip’s gaming capabilities are also noteworthy, offering high frame rates and efficient power use, tailored for premium-level gaming experiences.
In terms of imaging, the Dimensity 8450 includes a multi-frame EIS engine that enables 4K60 HDR video with enhanced stabilization. The built-in Imagiq 1080 ISP supports in-sensor zoom with QPD remosaic technology, enhancing photo quality.
Connectivity is another strong point, with the 5G-A modem offering up to 3CC-CA and download speeds of up to 5.17Gbps. The chip also supports WQHD+ displays up to 144Hz and dual screen output.
During the India Summit, MediaTek hosted live demonstrations including AI-powered features such as reasoning-enhanced Q\&A chats, AI-based telephoto imaging, and gameplay showcases of BGMI and Genshin Impact.
The event also brought together leading OEM partners like OPPO, Vivo, Motorola, Realme, Redmi, Infinix, Samsung, Lava, and Tecno. Several upcoming devices were showcased, including the Moto Edge 60 Pro with Dimensity 8350, the OPPO Find X8 Pro, Vivo X200 Pro, and Realme GT 7 with Dimensity 9400/9400e, and the Tecno Phantom V Fold 2 with Dimensity 9000+.
OPPO will be the first OEM to launch a smartphone with the new Dimensity 8450 chipset. The Reno14 Pro will debut with this chip, followed by another device in its K-series.
With its comprehensive Dimensity 5G portfolio — including the 9000, 8000, 7000, and 6000 series — MediaTek continues to offer powerful solutions for every smartphone tier, from entry-level to flagship.
